Description
The LAM 839-101612-054 is an electrostatic chuck (ESC) used in etching and ashing processes for semiconductor wafer manufacturing. It is part of LAM Research’s 839 series of ESCs, which are designed to provide precise and uniform wafer clamping for high-performance etching and ashing applications.
Key features of the LAM 839-101612-054:
- Electrostatic clamping: Utilizes electrostatic forces to hold the wafer securely onto the chuck, ensuring minimal contact and preventing damage to the wafer surface.
- Uniform clamping force: Provides a uniform distribution of clamping force across the wafer, ensuring consistent etching and ashing results.
- High temperature capability: Can withstand high temperatures associated with etching and ashing processes.
- Corrosion resistance: Resists corrosion from the harsh chemicals used in etching and ashing processes.
- Long lifespan: Designed for a long lifespan to minimize maintenance and downtime.
Applications of the LAM 839-101612-054:
- Silicon wafer etching: Used in etching processes to create patterns on silicon wafers for semiconductor devices.
- Dielectric etching: Used in etching processes to remove dielectric materials from silicon wafers.
- Metal etching: Used in etching processes to remove metal layers from silicon wafers.
- Ashing: Used in ashing processes to remove photoresist and other organic materials from silicon wafers.
Specifications of the LAM 839-101612-054:
- Wafer diameter: Up to 200 mm (8 inches)
- Clamping force: Up to 1000 N
- Temperature range: Up to 400°C (752°F)
- Material: Stainless steel
- Dimensions: 300 mm x 300 mm x 25 mm (11.8 inches x 11.8 inches x 0.98 inches)
